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Chipboard Core Raised Floor Solutions

Lightweight Chipboard Core Raised Floor Panels (Cost-Optimised)
Chipboard core panels are a cost-effective raised-floor solution with reduced transport weight, available in encapsulated, PVC, HPL and ceramic finishes. Suitable for offices and technical spaces where fast deployment and flexible underfloor distribution are required.
Panel Size
600 × 600 mm

Core
High Density Chipboard

Finish Options
Encap / PVC / HPL / Ceramic

Description

Chipboard Core Raised Floor Solutions

Chipboard core panels provide a cost-optimised raised-floor platform with multiple surface options for different wear and ESD needs.
Designed around the 600 × 600 mm modular format, they enable flexible underfloor infrastructure distribution in offices and technical rooms.

600 × 600 mm Standard
Loose Lay System
Lower Transport Weight
Encapsulated / PVC / HPL / Ceramic
Pedestal + Stringer Options

Key Technical Facts (Typical)

Panel size
600 × 600 mm
Core density (typ.)
~680–720 kg/m³
System type
Loose lay
Fire reaction (typ.)
EN 13501-1 Bfl-s1

Performance varies by selected model and surface type.

Documents

Go to Downloads

Add your Devis-hosted brochures in the Downloads section.

Overview

Chipboard raised floor panels are widely used where a lightweight, flexible underfloor distribution solution is required.
They support practical deployment for office and technical spaces and can be specified with different top finishes for anti-static and durability targets.

Technical Specifications (Typical)

Panel format 600 × 600 mm
Core High density chipboard (particleboard)
Encapsulation (typ.) Galvanised steel encapsulation options available (model dependent)
System type Loose lay
Fire performance (typ.) Reaction class EN 13501-1 Bfl-s1; resistance references available per configuration
Acoustics (typ.) System acoustic behaviour depends on pedestal adhesive and FFH

Model Matrix

Model Finish / Build Typical Use
MXF-EN30 Chip encapsulated (galvanized steel) General technical spaces / cost optimised
MXF-VCB30 Chip PVC coated ESD and easy-clean environments
MXF-HCB30 Chip HPL coated Higher wear resistance / premium finish
MXF-CER40 Chip ceramic coated High durability / special architectural requirements

Options & Accessories

Pedestals / Feet

Galvanized steel pedestal options; FFH depends on system height selection.

Stringers (Bracing)

Clip-on and screwed stringers to improve lateral rigidity at higher FFH.

Adhesives / Acoustic

Standard or acoustic pedestal adhesive options to improve impact sound behaviour.

Finishes

Encapsulated / PVC / HPL / Ceramic surface alternatives (project-dependent).

Description

Chipboard Core Raised Floor Solutions

Chipboard core panels provide a cost-optimised raised-floor platform with multiple surface options for different wear and ESD needs.
Designed around the 600 × 600 mm modular format, they enable flexible underfloor infrastructure distribution in offices and technical rooms.

600 × 600 mm Standard
Loose Lay System
Lower Transport Weight
Encapsulated / PVC / HPL / Ceramic
Pedestal + Stringer Options

Key Technical Facts (Typical)

Panel size
600 × 600 mm
Core density (typ.)
~680–720 kg/m³
System type
Loose lay
Fire reaction (typ.)
EN 13501-1 Bfl-s1

Performance varies by selected model and surface type.

Documents

Go to Downloads

Add your Devis-hosted brochures in the Downloads section.

Overview

Chipboard raised floor panels are widely used where a lightweight, flexible underfloor distribution solution is required.
They support practical deployment for office and technical spaces and can be specified with different top finishes for anti-static and durability targets.

Technical Specifications (Typical)

Panel format 600 × 600 mm
Core High density chipboard (particleboard)
Encapsulation (typ.) Galvanised steel encapsulation options available (model dependent)
System type Loose lay
Fire performance (typ.) Reaction class EN 13501-1 Bfl-s1; resistance references available per configuration
Acoustics (typ.) System acoustic behaviour depends on pedestal adhesive and FFH

Model Matrix

Model Finish / Build Typical Use
MXF-EN30 Chip encapsulated (galvanized steel) General technical spaces / cost optimised
MXF-VCB30 Chip PVC coated ESD and easy-clean environments
MXF-HCB30 Chip HPL coated Higher wear resistance / premium finish
MXF-CER40 Chip ceramic coated High durability / special architectural requirements

Options & Accessories

Pedestals / Feet

Galvanized steel pedestal options; FFH depends on system height selection.

Stringers (Bracing)

Clip-on and screwed stringers to improve lateral rigidity at higher FFH.

Adhesives / Acoustic

Standard or acoustic pedestal adhesive options to improve impact sound behaviour.

Finishes

Encapsulated / PVC / HPL / Ceramic surface alternatives (project-dependent).