Description
Chipboard Core Raised Floor Solutions
Chipboard core panels provide a cost-optimised raised-floor platform with multiple surface options for different wear and ESD needs.
Designed around the 600 × 600 mm modular format, they enable flexible underfloor infrastructure distribution in offices and technical rooms.
Loose Lay System
Lower Transport Weight
Encapsulated / PVC / HPL / Ceramic
Pedestal + Stringer Options
Key Technical Facts (Typical)
600 × 600 mm
~680–720 kg/m³
Loose lay
EN 13501-1 Bfl-s1
Overview
Chipboard raised floor panels are widely used where a lightweight, flexible underfloor distribution solution is required.
They support practical deployment for office and technical spaces and can be specified with different top finishes for anti-static and durability targets.
Technical Specifications (Typical)
| Panel format | 600 × 600 mm |
|---|---|
| Core | High density chipboard (particleboard) |
| Encapsulation (typ.) | Galvanised steel encapsulation options available (model dependent) |
| System type | Loose lay |
| Fire performance (typ.) | Reaction class EN 13501-1 Bfl-s1; resistance references available per configuration |
| Acoustics (typ.) | System acoustic behaviour depends on pedestal adhesive and FFH |
Model Matrix
| Model | Finish / Build | Typical Use |
|---|---|---|
| MXF-EN30 | Chip encapsulated (galvanized steel) | General technical spaces / cost optimised |
| MXF-VCB30 | Chip PVC coated | ESD and easy-clean environments |
| MXF-HCB30 | Chip HPL coated | Higher wear resistance / premium finish |
| MXF-CER40 | Chip ceramic coated | High durability / special architectural requirements |

